MicroQ Services
With our expertise in SMT Assembly and Chip & Wire Processes, we support customer requirements from the developmental prototype stages to production. We believe our role in the supply chain is to support our customer’s ability to deliver quality product on time, within budget.
Die Attach
- Eutectic w/AuSi or AuSn
- Conductive or non-conductive epoxy
- Epoxy Die Attach as small as 3 mils
- Die attach on flex circuits
Wire Bonding
- Ball bonding for robust bonds
- Wedge bonding for ultra-fine pitch
- Wire diameter length down to .7 mils
- Semi-automatic and programmable for consistent results.
Wire Pull & Die Shear Testing
- Used to measure and evaluate bond strength.
- Wire pull testing ensures our bonds comply with MIL-STD-883 standards.
- Shear tests measure the force required to break the bond between the die and substrates.
- Ensures compliance with MIL-STD-883 standards.
Flip Chip Attach
- Place die with bump pitch down to 5 microns
- Flip Chip attachment is 5 microns accuracy
SMT
- We can manually assemble or utilize our high speed automatic pick and place.
- Capable of placing components down to size 01005 with 99.95% accuracy.
- 5-zone reflow oven ensures accurate thermal profiles whether it’s leaded or RoHS-compliant.
Through-hole
- Our expert technicians can handle through-hole and mixed-technology boards up to IPC-A-610 Class 2 or 3 standards, per your specifications
- Consignment or turnkey solutions
Rework Services
- Remove and replace damaged or defective parts
- We can rework most leaded and leadless packages
BGA Re-ball and Rework
- Remove and Rework of BGA components on populated PCBs
- Remove and re-balling of solder balls on BGA packages