Micro Q San Diego

Services & Equipment

MicroQ Services

With our expertise in SMT Assembly and Chip & Wire Processes, we support customer requirements from the developmental prototype stages to production. We believe our role in the supply chain is to support our customer’s ability to deliver quality product on time, within budget.


Components with sizes from 01005 up to 1.3 x 3.1″are placed. The machine achieves 10,800 cph (IPC9850) and still remains 50 µm accuracy, 3 sigma with a two nozzle head. first machine in its class with linear motors and a mineral cast frame, providing excellent speed, stability, accuracy, and making it perfectly suited for use in small to medium production environments.

1707 Mark III Series – SMT Reflow Oven

The 1700 models support high mix / medium volume throughput… at speeds up to 24 inches (60 centimeters) per minute. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. The Mark III system includes features 5 heated zones to allow “Profile Sculpting”.

iBond 5000 Wedge Bonders

The iBond5000 manual wedge bonder is for ultrasonic Wedge,Tab, Stitch & Ribbon bonding using aluminium, gold or copper wires.

iBond 5000 Ball Bonder

An advanced ball bonder used for process development production, research or added manufacturing support. The iBond5000 provides the high yield and excellent repeatability needed for every gold ball bonding application including: Optoelectronic Modules, Hybrids/MCMs, Microwave Products, Discrete Devices/Lasers and much more.

XZYTEC 70 Condor

Designed for pull and shear test up to 40 kgt. Performing wire pull, ball shear, wedge shear, solder ball shear and shear.

AOI systems

For both pre-reflow and post-reflow inspection covering a comprehensive list of component and solder joint defect categories and are fully capable of inspecting 01005 components and beyond. part presence/absence verification, part polarity and pin #1 orientation, part position and skew errors, laser marking, wrong part and device differences such as: labels and colour variations.


A high level of process modularity allows all rework process steps within one system. The FINEPLACER® pico rs system is at home in R&D, process development, prototyping and production environments.Application area from 01005 up to large BGA on small to medium sized PCBs, with the goal to have highly reproducible soldering results.

Unitek Peco Gap Welding

The parallel gap welding was conducted using a variety of weld voltage/pulse duration settings and a nominal 0.05-mm-thick by 0.38-mm-wide pure gold ribbon.

MPM SPM Screen Printer

The SPM is a very accurate screen printer built for precision batch printing and prototype work. The standard magnetic tooling and PC-based control system allow for quick changeover and maximum flexibility. Also available are several options that will turn the base SPM into an ultra-fine pitch printer with print sizes down to 12 mil pitch, or better.

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Quality and affordable services with quick turn-around time and great capabilities!

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